DC 欄位 | 值 | 語言 |
dc.contributor.author | 莊東漢 | zh_TW |
dc.creator | 莊東漢 | - |
dc.date | 2005 | zh_TW |
dc.date.accessioned | 2006-07-25T10:43:32Z | - |
dc.date.accessioned | 2018-06-28T22:05:03Z | - |
dc.date.available | 2006-07-25T10:43:32Z | - |
dc.date.available | 2018-06-28T22:05:03Z | - |
dc.date.issued | 2005 | - |
dc.identifier | 932216E002024 | zh_TW |
dc.identifier.uri | http://ntur.lib.ntu.edu.tw//handle/246246/12497 | - |
dc.description.abstract | 本計畫針對化銀基板無鉛銲錫球格陣列構裝接點的可靠度分析,進行預處理與冷熱循環試驗。預處理主要在於評估產品對迴銲製程環境的敏感性,冷熱循環試驗則模擬銲錫接點實際開關操作的溫度變化,而冷熱循環試驗包括疲勞壽命評估與疲勞裂紋觀
察兩部份。為了比較化銀基板與其它銲墊表面鍍層的可靠度,本計畫同時涵蓋化金與化錫膜,並選用公認較具潛力的Sn3Ag0.5Cu 無鉛銲錫進行研究。 | zh_tw |
dc.description.abstract | This project is focused on the study
of the reliability of Pb-free solder joints
in ball grid array packages when applied
with the immersion Ag surface finish.
For reliability evaluation, the
precondition test and temperature
cycling test (TCT) are employed.
The precondition test is used for the
evaluation of product sensitivity to the
environment of reflow processing, while
the TCT is for the simulation of the
temperature change during the actual
on/off operation of the solder joints. The
temperature cycling test involves the
fatigue life evaluation and the fatigue
crack observation. Immersion Au is also
employed in this project in order to
place the joint reliability of the
immersion Ag pad in contrast with other
surface finishes. The compositions of
Pb-free solders are: Sn3Ag0.5Cu. | en |
dc.format | application/pdf | zh_TW |
dc.format.extent | 1100454 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.language | zh-TW | zh_TW |
dc.language.iso | zh_TW | - |
dc.publisher | 臺北市:國立臺灣大學材料科學與工程學系暨研究所 | zh_TW |
dc.rights | 國立臺灣大學材料科學與工程學系暨研究所 | zh_TW |
dc.subject | 表面鍍層(化銀 | zh_tw |
dc.subject | 化金) | zh_tw |
dc.subject | 無鉛銲錫 | zh_tw |
dc.subject | 球格陣列構裝 | zh_tw |
dc.subject | 預處理 | zh_tw |
dc.subject | 冷熱循環試驗 | zh_tw |
dc.subject | Surface finishes (immersion Ag | en |
dc.subject | immersion Au) | en |
dc.subject | Pb-free solders | en |
dc.subject | BGA | en |
dc.subject | Precondition | en |
dc.subject | thermal cycling test | en |
dc.title | 不同鍍層基板無鉛銲錫球格陣列構裝接點之預處理與冷熱循環試驗 | zh_TW |
dc.type | report | en |
dc.identifier.uri.fulltext | http://ntur.lib.ntu.edu.tw/bitstream/246246/12497/1/932216E002024.pdf | - |
dc.coverage | 計畫年度:93;起迄日期:2004-08-01/2005-09-30 | zh_TW |
item.openairetype | report | - |
item.openairecristype | http://purl.org/coar/resource_type/c_93fc | - |
item.fulltext | with fulltext | - |
item.grantfulltext | open | - |
item.languageiso639-1 | zh_TW | - |
item.cerifentitytype | Publications | - |
顯示於: | 材料科學與工程學系
|