https://scholars.lib.ntu.edu.tw/handle/123456789/75184
標題: | Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions | 作者: | Chuang, T. H. Yu, C. L. Chang, S. Y. Wang, S. S. ChuangTH |
關鍵字: | In-49Sn/Cu; Intermetallic compounds; Soldering | 公開日期: | 2002 | 卷: | 31 | 期: | 6 | 起(迄)頁: | 640-645 | 來源出版物: | Journal of Electronic Materials | 摘要: | For the application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds formed at the In-49Sn/Cu interface are investigated. Scanning electron microscopy (SEM) observations show that the interfacial intermetallics consist of a planar layer preceded by an elongated scalloped structure. Electron-probe microanalyzer analyses indicate that the chemical compositions of the planar layer and the scalloped structure are Cu74.8In12.2Sn13.0 and Cu56.2In20.1Sn23.7, respectively, which correspond to the ε-Cu3(In,Sn) and η-Cu6(In,Sn)5 phases. Kinetics analyses show that the growth of both intermetallic compounds is diffusion controlled. The activation energies for the growth of η- and ε-intermetallics are calculated to be 28.9 kJ/mol and 186.1 kJ/mol. Furthermore, the formation mechanism of intermetallic compounds during the In-49Sn/Cu soldering reaction is clarified by marking the original interface with a Ta-thin film. Wetting tests are also performed, which reveal that the contact angles of liquid In-49Sn drops on Cu substrates decline to an equilibrium value of 25°C. |
URI: | http://ntur.lib.ntu.edu.tw//handle/246246/95932 https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036610350&doi=10.1007%2fs11664-002-0136-1&partnerID=40&md5=d819d10502ebeb70ead4de1642d9bdb0 |
ISSN: | 03615235 | SDG/關鍵字: | Activation energy; Composition; Contact angle; Copper; Diffusion in solids; Grain growth; Growth kinetics; Indium alloys; Scanning electron microscopy; Soldering; Soldering alloys; Wetting; Electron probe microanalysis; Indium tin alloy; Interfacial reactions; Mechanical behavior; Wetting tests; Intermetallics |
顯示於: | 材料科學與工程學系 |
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