https://scholars.lib.ntu.edu.tw/handle/123456789/75223
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chuang, T.H. | en |
dc.contributor.author | Jain, C.C. | en |
dc.contributor.author | Wu, H.M. | en |
dc.contributor.author | ChuangTH | - |
dc.creator | Chuang, T.H.; Jain, C.C.; Wu, H.M. | - |
dc.date | 2008 | en |
dc.date.accessioned | 2009-01-06T01:34:05Z | - |
dc.date.accessioned | 2018-06-28T22:12:45Z | - |
dc.date.available | 2009-01-06T01:34:05Z | - |
dc.date.available | 2018-06-28T22:12:45Z | - |
dc.date.issued | 2008 | - |
dc.identifier.uri | http://ntur.lib.ntu.edu.tw//handle/246246/95971 | - |
dc.format | application/pdf | en |
dc.format.extent | 909091 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.language | en | en |
dc.language.iso | en_US | - |
dc.relation | Journal of Electronic Materials 37 (11): 1734-1741 | en |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish | en |
dc.type | journal article | en |
dc.relation.pages | 1734-1741 | - |
dc.relation.journalvolume | 37 | - |
dc.relation.journalissue | 11 | - |
dc.identifier.uri.fulltext | http://ntur.lib.ntu.edu.tw/bitstream/246246/95971/1/113.pdf | - |
item.fulltext | with fulltext | - |
item.cerifentitytype | Publications | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | open | - |
item.openairetype | journal article | - |
item.languageiso639-1 | en_US | - |
顯示於: | 材料科學與工程學系 |
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