https://scholars.lib.ntu.edu.tw/handle/123456789/75245
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chuang, T.H. | en |
dc.contributor.author | Wu, H.F. | en |
dc.contributor.author | Huang, K.W. | en |
dc.contributor.author | Yen, S.F. | en |
dc.contributor.author | Lin, H.J. | en |
dc.creator | Chuang, T.H.; Wu, H.F.; Huang, K.W.; Yen, S.F.; Lin, H.J. | en |
dc.date | 2004 | en |
dc.date.accessioned | 2009-01-06T01:38:57Z | - |
dc.date.accessioned | 2018-06-28T22:12:52Z | - |
dc.date.available | 2009-01-06T01:38:57Z | - |
dc.date.available | 2018-06-28T22:12:52Z | - |
dc.date.issued | 2004 | - |
dc.identifier.uri | http://ntur.lib.ntu.edu.tw//handle/246246/95994 | - |
dc.language.iso | en_US | - |
dc.relation | J. Chin. Colloid and Interface Soc. 26: 69-79 | en |
dc.relation.ispartof | J. Chin. Colloid and Interface Soc. 26: | - |
dc.title | Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints | en |
dc.type | journal article | en |
dc.relation.pages | 69-79 | - |
item.openairetype | journal article | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.languageiso639-1 | en_US | - |
item.cerifentitytype | Publications | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。