https://scholars.lib.ntu.edu.tw/handle/123456789/75622
Title: | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | Authors: | Hu, Y. C. Lin, Y. H. Kao, C. R. Tu, K. N. |
Issue Date: | Nov-2003 | Journal Volume: | 18 | Journal Issue: | 11 | Start page/Pages: | 2544-2548 | Source: | Journal of Materials Research | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/198842 |
Appears in Collections: | 材料科學與工程學系 |
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