https://scholars.lib.ntu.edu.tw/handle/123456789/75651
Title: | 先進封裝技術中金脆效應對銲點影響之探討 | Authors: | 何政恩 蕭麗娟 高振宏 |
Issue Date: | Feb-2002 | Journal Volume: | 13 | Journal Issue: | 2 | Start page/Pages: | 73-78 | Source: | 電子與材料 | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/198881 |
Appears in Collections: | 材料科學與工程學系 |
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