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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
Details
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
Resource
Materials & Design, 39, 475-483
Journal
Materials & Design
Pages
475-483
Date Issued
2012
Date
2012
Author(s)
Chuang, T.H.
Tsao, L.C.
Chung, Chien-Han
Chang, S.Y.
DOI
10.1016/j.matdes.2012.03.021
URI
http://ntur.lib.ntu.edu.tw//handle/246246/243564
Type
journal article
File(s)
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Name
04.pdf
Size
23.44 KB
Format
Adobe PDF
Checksum
(MD5):e2436c69de9ba88b1e980af22d8d5778
