Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints

Resource

Journal of electronic materials, 39(12), 2528-2535

Journal

Journal of electronic materials

Journal Volume

39

Journal Issue

12

Pages

2528-2535

Date Issued

2010

Date

2010

Author(s)

Tsai, M.Y.

Lin, Y.L.

Lin, Y.W.

Ke, J.H.

C. ROBERT KAO

DOI

URI

Type

journal article

File(s)

Name

267.pdf

Size

23.41 KB

Format

Adobe PDF

Checksum

(MD5):60bda751ece52b68dcc0982765d4ff53