Novel Cu-RuNx composite layer with good solderability and very low consumption rate

Resource

Journal of Alloys and Compounds, 504(2), L25-L27

Journal

Journal of Alloys and Compounds

Journal Volume

504

Journal Issue

2

Pages

-

Date Issued

2010

Date

2010

Author(s)

Chuang, H.Y.

Lin, C.H.

Chu, J.P.

DOI

URI

Type

journal article

File(s)

Name

305.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):5c72fe6273a2d85efb24bef80b113ddf