https://scholars.lib.ntu.edu.tw/handle/123456789/76057
Title: | Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints | Authors: | Lin, Hsiu-Jen Chuang, Tung-Han |
Issue Date: | 2010 | Journal Volume: | 500 | Journal Issue: | 2 | Start page/Pages: | 167-174 | Source: | Journal of Alloys and Compounds | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/243873 | DOI: | 10.1016/j.jallcom.2010.03.233 |
Appears in Collections: | 材料科學與工程學系 |
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