Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

Resource

Journal of Alloys and Compounds, 499(2), 149-153

Journal

Journal of Alloys and Compounds

Pages

149-153

Date Issued

2010

Date

2010

Author(s)

Yang, S.C.

Tsai, M.H.

DOI

URI

Type

journal article

File(s)

Name

321.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):0e7674e863c0cc132ccf178b3a046486