Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders

Resource

Journal of Alloys and Compounds, 493(1-2), 233-239

Journal

Journal of Alloys and Compounds

Pages

233-239

Date Issued

2010

Date

2010

Author(s)

Wang, Y.W.

Lin, Y.W.

DOI

URI

Type

journal article

File(s)

Name

357.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):5f8743a23d0ed3afd9bc79dc682f1ecb