https://scholars.lib.ntu.edu.tw/handle/123456789/76097
標題: | Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders | 作者: | Wang, Y.W. Lin, Y.W. C. ROBERT KAO |
公開日期: | 2010 | 起(迄)頁: | 233-239 | 來源出版物: | Journal of Alloys and Compounds | URI: | https://www.scopus.com/record/display.uri?eid=2-s2.0-77249094499&origin=resultslist&sort=plf-f&src=s&sid=496448ccfe2bcc4d95e3ba157a05e4a4&sot=b&sdt=b&s=TITLE-ABS-KEY%28Inhibiting+the+formation+of+microvoids+in+Cu3Sn+by+additions+of+Cu+to+solders%29&sl=92&sessionSearchId=496448ccfe2bcc4d95e3ba157a05e4a4&relpos=0 | DOI: | 10.1016/j.jallcom.2009.12.062 |
顯示於: | 材料科學與工程學系 |
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