高溫液滴產生器之設計及其噴滴行為之探討

Abstract

液滴產生在應用非常廣泛，其中錫鉛液滴產生的相關研究常應用於IC封裝產業。此篇論文中介紹一種脈衝高電流液滴產生器，而此種液滴產生器是利用給予的脈衝高電流電流與磁力交互產生的安培力迫使液滴與原本錫鉛流體分離，且此液滴產生器的特殊幾何形狀會將此安培力集中在噴嘴出口附近。另外，本篇論文亦針對在壓電式液滴產生器中常遇到的阻塞問題作深入研究，而此研究所得到的最佳操作條件亦可供為脈衝高電流液滴產生器的參考。在脈衝高電流液滴產生器中吾人已能夠產生大於三百安培及波寬100ns的電流加到錫鉛溶液中，但目前此電流所產生的安培力大小不足以產生錫鉛液滴，推測除了電流大小不夠大以外，電感效應亦是無法產生液滴的可能原因。在未來需要產生電流大小更大以及電感更小的電流來做進一部液滴產生最佳條件的測試。

Droplets generation has been investigated for many years because of its broad application, especially solder droplets that are usually used in IC packaging industries. In this paper a high pulse current method to generate solder droplets is introduced. The high pulse current is applied to the solder to generate an Ampere’s Force, and this force results in the break up of the droplets from the bulk fluid. The geometry of an electrically insulated solder container was designed to concentrate the energy at the exit. The investigation into the clogging test of another system, the piezoceramic droplet dispensing system, also helped find out the optimum condition in which the solder could be purged out smoothly. Pulsed current of more than 300Amp and pulse width 100ns has been produced and applied into the solder, but so far no droplets could be generated unless the applied anode voltage was higher than 5kV to form an arc. Presently the force produced from the current output is not enough to purge the solder out. Currents with narrower pulse width and less inductance might be needed in the future to produce more energy to generate the droplets.