A Study of a Thermal Droplet Generator Design and Its Performance
Date Issued
2006
Date
2006
Author(s)
Sung, Pei-Fang
DOI
en-US
Abstract
Droplets generation has been investigated for many years because of its broad application, especially solder droplets that are usually used in IC packaging industries. In this paper a high pulse current method to generate solder droplets is introduced. The high pulse current is applied to the solder to generate an Ampere’s Force, and this force results in the break up of the droplets from the bulk fluid. The geometry of an electrically insulated solder container was designed to concentrate the energy at the exit. The investigation into the clogging test of another system, the piezoceramic droplet dispensing system, also helped find out the optimum condition in which the solder could be purged out smoothly. Pulsed current of more than 300Amp and pulse width 100ns has been produced and applied into the solder, but so far no droplets could be generated unless the applied anode voltage was higher than 5kV to form an arc. Presently the force produced from the current output is not enough to purge the solder out. Currents with narrower pulse width and less inductance might be needed in the future to produce more energy to generate the droplets.
Subjects
液滴產生器
Droplet Generator
Type
thesis
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