A Study on Electrostatic Chucking Force of Dielectric Materials
Date Issued
2007
Date
2007
Author(s)
Chuang, Yu-Hsuan
DOI
zh-TW
Abstract
The Electrostatic Chuck (ESC) has been widely used in semiconductor industries, and now is being increasingly applied by other industries, for example, Flat Panel Display (FPD) industry, to hold ITO glasses. Previously, ESC was used only for silicon wafer. Based on our observations, however, the application of ESC might increase to a broader range because of its ability to chuck other materials as well. In this thesis, we discuss the effect of the chucking force on dielectric constants between different materials. We designed a chucking force experiment to test five different materials on an ESC test platform. We found different chucking forces of ESC due to variations in dielectric constant of the material and the chucking force was directly proportional to dielectric constant. We observed that one of the parameters of the chucking force could change with changing chucking material. As a result, original value of dielectric constant will change because ESC becomes multiple to the chucked material. A detailed explanation of this phenomenon has been provided in the thesis.
Subjects
靜電吸盤
介電材料
介電常數
吸附力
氦氣測漏率
Electrostatic Chuck
Dielectric materials
Dielectric Constant
Chucking Force
He Leakage Rate
Type
thesis
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