https://scholars.lib.ntu.edu.tw/handle/123456789/80901
Title: | 薄膜機械特性及殘留應力之反算偵測(2/3) | Authors: | 吳恩柏 | Keywords: | 數位投影疊紋法;立體顯微鏡;正弦強度光柵;DLP 投影機;相移;相位重 建法;薄膜量測;micro digital projection moiré;stereo zoom microscope;linear mismatch;phase shifting;surface profile measurement | Issue Date: | 31-Jul-2004 | Publisher: | 臺北市:國立臺灣大學應用力學研究所 | Abstract: | 隨著電子產品的微小化,許多光學量測 技術紛紛朝著微小尺寸表面量測發展。本文 成功結合數位投影疊紋法與立體顯微鏡,並 運用相移及相位重建技術重繪出物體的三維 表面輪廓。數位投影疊紋法不僅可直接用於 大尺寸表面量測,並可將電腦製作出的近似 正弦強度光柵,透過DLP 投影機及透鏡組後 導入至立體顯微鏡中,以用於小尺寸表面量 測。此法可產生最小5μm間距微光柵,適用 於50μm 的微小尺寸範圍,可架構成為新式三 維微小尺寸表面量測系統。由於投影疊紋法 有所謂線性錯配法,且搭配相移技術及本實 驗室發展的相位重建技術,可大大地增加疊 紋數目而提高解析能力,並應用於薄膜機械 特性及殘留應力之反算偵測。 With the rapid trend for miniaturization of electronic products, new optical techniques are increasingly needed for measuring the surface profile or deflection/warpage in the micro-scale for electronic packages mounted on printed circuit boards. In this paper, we have successfully reduced the grating spacing of the digital projection moiré (DPM) by directing the grating pattern into a stereo zoom microscope and performed surface profile measurement under this microscope. In this method, the reference grating is generated digitally having sinusoidal intensity. Another digitally generated grating is projected into the microscope to form the object grating. This is via a digital light processing (DLP) projector and a set of carefully arranged optical lens. The pitch of micro-scaled object gratings can be adjusted by the magnification of the microscope. As a result, this micro-scaled digital projection moiré method produces a 5-um pitch micro object grating and is suitable for surface profile measurement in a square dimension as small as 50-um. In order to obtain more fringes in each measurement, the method of linear mismatch is utilized and the guideline to achieve the optimal degree of linear mismatch between the reference and the object gratings is proposed. In addition, the phase shifting technique is employed to extract the data between the recorded fringes. These two procedures enhanced the measurement resolution to more than ten folds. Verification of the method is demonstrated by measuring the inclined plane of a micro prism. The deviation between the measured data and the given values is less than 5%. This method is then used to measure the profile of a solder ball on a flip chip package, thin film profile measurement. |
URI: | http://ntur.lib.ntu.edu.tw//handle/246246/21701 | Other Identifiers: | 922212E002009 | Rights: | 國立臺灣大學應用力學研究所 |
Appears in Collections: | 應用力學研究所 |
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922212E002009.pdf | 1.3 MB | Adobe PDF | View/Open |
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