高熱通量表面受調控噴霧冷卻實驗探討

Abstract

本研究以半導體製程方式，在玻璃晶圓 上以金製作高熱通量微型加熱器，同時在晶 圓上配製白金感溫元件，以量測在地溫度。 為散去加熱器所發出的熱量，本研究另行以 微機電製程之體型及表面微加工技術，在矽 晶圓上蝕刻截面為三角形的微通道，經對準 接合後，再抽真空與填充工作流體，製成流 道寬150μm、長度15mm 的微型熱管。 由於本計畫原先預計以FPGA 調控噴 射液珠數位電路，產生陣列霧狀液粒，在加 熱面上形成高散熱量的霧珠冷卻。但在製作 微型加熱器時，考慮到蒸發霧氣的散逸與冷 卻液的補充，因此在計畫執行時，改變成微 熱管的設計，並研製成功，具備沿熱管通道 量測現場溫度的能力。實驗結果顯示：本雛 型微熱管工作正常，可散逸至1W 的熱量。

In the present project, micro heat pipe chips were fabricated using surface machining and bulk machining of MEMS manufacturing. The channel of micro heat pipe is 150μm in width, and 15mm in length. A micro heater was deposited on a glass wafer to simulate hot spot of the micro heat pipe, in associated with four platinum thin-film resistors for temperature detecting along the micro channel. Three micro heat-pipe chips were studied. Test data showed that the micro heat pipes can work properly when 1W was applied to the heaters. The gravity-assistant fluid feedback and heat sink were used to improve the performance of the micro heat pipes. Both devices demonstrated workable prototype for minute heat dissipation.