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  4. Empirical Modeling of Work-In-Process Flow Time in Semiconductor Manufacturing
 
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Empirical Modeling of Work-In-Process Flow Time in Semiconductor Manufacturing

Date Issued
2005
Date
2005
Author(s)
Huang, Yuan-Hung
DOI
zh-TW
URI
http://ntur.lib.ntu.edu.tw//handle/246246/49152
Abstract
The services of the foundry cover mask design, fabrication, assembly, final test, and trouble shooting. In other words, the manufacturing department and the engineering department need to be more cooperated. To attain robust and acceptable delivery performance, the manufacturing department should not only focus on the machine utilization, but also on the WIP behavior. As claimed to be manufacturing service, the niche is to meet the customer requirement. The challenge will be to overcome the controllability and predictability problems, service monitoring and control of the business orders. In IC supply chain, a chip provider pays attention to the current state of released orders in order to meet the market requirement. Hence, on customer satisfaction, there are two key performance indexes at the foundry: delivery schedule accuracy and order fulfillment lead time. For these two indexes, a fully loaded foundry model based on simulation program has been established in this thesis to analyze the WIP behavior. The research is to obtain the mean and variance of the flow time. The distribution of the flow time has been validated and it seems to be the normal distribution. Another core issue is to analyze the relationship between system utilization and flow time; our result shows that the relationship follows an exponential function. Based on it, foundry can provide IC design house the forecasting flow time with the current capacity utilization, and as the adjustment reference of order release time.
Subjects
系統模擬
在製品流動行為
達交績效
半導體製造供應鏈
system simulation
WIP behavior
delivery performance
IC supply chain
Type
thesis

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