https://scholars.lib.ntu.edu.tw/handle/123456789/98828
Title: | SHEWMA: an End-of-line SPC Scheme Using Wafer Acceptance Test Data | Authors: | Fan, Chih-Min Guo, Ruey-Shan Chang, Shi-Chung SHI-CHUNG CHANG |
Issue Date: | Aug-2000 | Journal Volume: | 13 | Journal Issue: | 3 | Start page/Pages: | 344-357 | Source: | IEEE Transactions on Semiconductor Manufacturing | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/83568 | DOI: | 10.1109/66.857945 |
Appears in Collections: | 工商管理學系 |
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