Full wave characterization of a through hole via discontinuity in multi-layered packaging

Hsu, Show-GwoShow-GwoHsuWu, Ruey-BeeiRuey-BeeiWu2007-04-192018-07-062007-04-192018-07-061994http://scholars.lib.ntu.edu.tw/handle/123456789/310442http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910032404/1/00594151.pdfapplication/pdf289290 bytesapplication/pdfen-USFull wave characterization of a through hole via discontinuity in multi-layered packagingconference paper10.1109/epep.1994.5941512-s2.0-0028732116http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910032404/1/00594151.pdf