Massive Spalling of Intermetallic in Solder-Substrate Reactions due to limited Supply of the Active Element

Yang, S. C.S. C.YangHo, C. E.C. E.HoChang, C. W.C. W.ChangKao, C. R.C. R.Kao2008-12-312018-06-282008-12-312018-06-282007http://ntur.lib.ntu.edu.tw//handle/246246/95483application/pdf688181 bytesapplication/pdfen-USMassive Spalling of Intermetallic in Solder-Substrate Reactions due to limited Supply of the Active Elementjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95483/1/06.pdf