Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB)

S.-T. ChenC.-W. TsaiS.-M. WuC.-P. HungTZONG-LIN WU2018-09-102018-09-102003-10http://scholars.lib.ntu.edu.tw/handle/123456789/304260Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB)conference paper