Reliability of micro-interconnects in 3D IC packages

Robert Kao, C.C.Robert KaoWu, Albert T.Albert T.WuTu, King-NingKing-NingTuLai, Yi-ShaoYi-ShaoLaiC. ROBERT KAO2020-05-122020-05-12201300262714https://scholars.lib.ntu.edu.tw/handle/123456789/490973Reliability of micro-interconnects in 3D IC packagesjournal article10.1016/j.microrel.2012.11.005https://linkinghub.elsevier.com/retrieve/pii/S0026271412005136