Yang T.L.Yu J.J.Shih W.L.CHUN-HWAY HSUEHC. ROBERT KAO2019-11-272019-11-27201409258388https://www.scopus.com/inward/record.uri?eid=2-s2.0-84899514236&doi=10.1016%2fj.jallcom.2014.03.165&partnerID=40&md5=8c61b6d653c7814d333568fd7833bb3chttps://scholars.lib.ntu.edu.tw/handle/123456789/432613Effects of silver addition on Cu-Sn microjoints for chip-stacking applicationsjournal article10.1016/j.jallcom.2014.03.1652-s2.0-84899514236