Huang C.-PLee T.-YYang J.-JLin G.-TCHIEN-CHUNG LIN2022-04-252022-04-25202119430655https://www.scopus.com/inward/record.uri?eid=2-s2.0-85111565791&doi=10.1109%2fJPHOT.2021.3099313&partnerID=40&md5=4cbb0bc6cec383bb97415d3afc652d13https://scholars.lib.ntu.edu.tw/handle/123456789/606997A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging. Under 1 W/cm2, the areal temperature decreased from 38.5 °C (without Sn-ball) to 32.3 °C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package. Specifically, the introduction of the metal ball structure engendered a two- to three-fold increase in lifetime. The study findings could contribute toward integrating quantum dots into photonic devices. ? 2009-2012 IEEE.heatlight-emitting diodesQuantum dotNanocrystalsPhotonic devicesSemiconductor quantum dotsColloidal quantum dotsHeat distributionOptical intensitiesPackaging structurePerformance enhancementsRadiant fluxReliability managementThree foldsOrganic light emitting diodes (OLED)journal article10.1109/JPHOT.2021.30993132-s2.0-85111565791