An analytical procedure for estimating field lifetime and failure rate of electronic packages

Hsu Y.Su C.-Y.Wu W.-F.2019-07-242019-07-2420142533839https://www.scopus.com/inward/record.uri?eid=2-s2.0-84892904696&doi=10.1080%2f02533839.2012.751333&partnerID=40&md5=031975d6db0472915e99947c8b92c125https://scholars.lib.ntu.edu.tw/handle/123456789/415004An analytical procedure for estimating field lifetime and failure rate of electronic packagesjournal article10.1080/02533839.2012.7513332-s2.0-84892904696