Lin Y.H.Hu Y.C.Tsai J.C. ROBERT KAO2019-11-272019-11-272002078037682X9780780376823https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966603300&doi=10.1109%2fEMAP.2002.1188846&partnerID=40&md5=c0a1369b4261d2d53eac4eb07c35ef4ehttps://scholars.lib.ntu.edu.tw/handle/123456789/432736New failure mode induced by electric current in flip chip solder jointconference paper10.1109/EMAP.2002.11888462-s2.0-84966603300