A new integration of device-scale micropackaging with bi-directional tunable capacitors

Inst. of Appl. Mech., National Taiwan Univ.Chu, Chia-HuaChia-HuaChuHuang, Long-SunLong-SunHuangChen, Jen-YiJen-YiChenLee, I-LienI-LienLeeChang, PeizenPeizenChang2007-04-192018-06-292007-04-192018-06-292003-01http://ntur.lib.ntu.edu.tw//handle/246246/2007041910021003application/pdf301343 bytesapplication/pdfen-US[SDGs]SDG7A new integration of device-scale micropackaging with bi-directional tunable capacitorsother10.1109/MEMSYS.2003.1189834http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910021003/1/01189834.pdf