3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods

Lin, L.J.-H.L.J.-H.LinChang, H.-P.H.-P.ChangWu, T.-L.T.-L.WuChiou, Y.-P.Y.-P.ChiouTZONG-LIN WUYIH-PENG CHIOU2018-09-102018-09-102012http://www.scopus.com/inward/record.url?eid=2-s2.0-84875481074&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/3724043D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methodsconference paper10.1109/EDAPS.2012.64694152-s2.0-84875481074