Area-I/O flip-chip routing for chip-package co-design considering signal skews

Fang, J.-W.J.-W.FangYAO-WEN CHANG2018-09-102018-09-102010http://www.scopus.com/inward/record.url?eid=2-s2.0-77951689218&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/358172Area-I/O flip-chip routing for chip-package co-design considering signal skewsjournal article10.1109/TCAD.2010.20435862-s2.0-77951689218WOS:000278502500005