Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration

Lin Y.L.Lai Y.S.Lin Y.W.C. ROBERT KAO2019-11-272019-11-27200803615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-37249038598&doi=10.1007%2fs11664-007-0293-3&partnerID=40&md5=d93c7be613ae33d55adf49ca1208fb7dhttps://scholars.lib.ntu.edu.tw/handle/123456789/432688Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigrationjournal article10.1007/s11664-007-0293-32-s2.0-37249038598