Hot embossing of microstructure with moving induction heating and gas-assisted pressuring

Kao, C.-C.C.-C.KaoKe, K.-C.K.-C.KeHung, W.-C.W.-C.HungSEN-YEU YANG2021-02-042021-02-042020Kao, C.-C.;Ke, K.-C.;Hung, W.-C.;Yang, S.-Y.https://www.scopus.com/inward/record.url?eid=2-s2.0-85070308487&partnerID=40&md5=38c18efefd9885dcd65b302745a40976https://scholars.lib.ntu.edu.tw/handle/123456789/547508[SDGs]SDG3[SDGs]SDG7[SDGs]SDG9Hot embossing of microstructure with moving induction heating and gas-assisted pressuringjournal article10.1007/s00542-019-04560-72-s2.0-85070308487WOS:000513013000027