Tsai J.Y.Chang C.W.Ho C.E.Lin Y.L.C. ROBERT KAO2019-11-272019-11-27200603615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644450179&doi=10.1007%2fs11664-006-0185-y&partnerID=40&md5=4b7ebda168056be021e064571056ec4chttps://scholars.lib.ntu.edu.tw/handle/123456789/432710Microstructure evolution of gold-tin eutectic solder on Cu and Ni substratesjournal article10.1007/s11664-006-0185-y2-s2.0-32644450179