Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

Ke, J.H.J.H.KeChuang, H.Y.H.Y.ChuangShih, W.L.W.L.ShihC. ROBERT KAO2012-10-242018-06-282012-10-242018-06-282012http://ntur.lib.ntu.edu.tw//handle/246246/243608en-US[SDGs]SDG15Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressingjournal article10.1016/j.actamat.2011.12.021http://ntur.lib.ntu.edu.tw/bitstream/246246/243608/-1/50.pdf