2018-11-012024-05-15https://scholars.lib.ntu.edu.tw/handle/123456789/663916摘要：本產學研究計畫，擬與高力熱處理工業股份有限公司合作研究，進行研發一種新型的微流道散熱裝置。此散熱裝置是一種可以將局部熱源，快速傳導到大面積平板的高性能裝置，亦稱為均熱板，其結構主要是由內壁具有微結構的兩片金屬板，上下焊接而成的真空腔體，使工作流體可以快速的進行吸熱汽化，再將熱帶走。未來，此裝置可應用於LED、手機、CPU等小型電子裝置的散熱元件使用。本計畫原在雙方期前規劃討論時，以三年期研發來做規劃，但因為與高力公司為第一次合作，雙方同意先申請一年，視合作情況，如可以，再申請第二年與第三年的合作計畫。本年度規劃的研究工作，包括：毛細結構研發、製程設計、散熱測試、裝置參數的實驗設計。 目前高性能的散熱元件市場，包括有伺服器、通訊、高階繪圖卡、高效率LED散熱元件等，已廣泛使用均熱板取代傳統的熱導管，以解決更嚴苛與高效率的散熱問題。均熱板與熱導管的原理架構是相同的，只是熱傳導的方式不相同，熱導管的熱傳導方式是一維與線的熱傳方式，而均熱板是二維與面的熱傳方式，所以均熱板可以解決更為嚴苛與高效率的散熱問題，其較熱導管的導熱性能高出約10 -20%，能將發熱源的熱點，快速均勻散佈到其他地方，將熱量帶走﹔同時二維的散熱結構，可以有更多的結構設計變化。 另外，現今的技術，多使用銅網當作回收工作流體的微結構，本研究欲將微結構與下金屬板件一體成形，使用微製程設計來生產微結構，並進行毛細力的研究。在設計得到最佳化微結構後，使用一體成形的金屬板件製程，將微結構以開模作上，並進行熱焊接封裝，再進行實機測試，以計算真實的導熱效率，並設計生成最佳化微結構，以達到具有高效率回收工作流體，且降低均熱板的成本。<br> Abstract: This project is to collaborate with KAORI HEAT TREATMENT CO., LTD. (高力熱 處理工業股份有限公司) for a joint research on a topic related to vapor chamber. We have discussed the associate research works for quite some time and have worked out a three-year plan. However, this proposal is to apply for one year first. If both sides work together well, we will apply the second and the third year projects. Nowadays, the vapor chamber has been widely used as a high-efficiency heat sink element of server, communication device, graphic card, and LED, etc. Vapor chamber is a heat dissipation device that can rapidly conduct heat to the whole surface area. The device consists of an upper metal plate, the wick structure, and a lower metal plate. The upper and lower metal plates are sealed together and the inside is vacuumed. The wick structure is in-between the two plates for recycling the working fluid. In the thermal cycle, the thermal energy will be absorbed by the fluid and leads to become vapor phase. The vapor will flow into whole chamber and the energy will be dissipated from the metal plate. The vapor will change to liquid phase that will be recycled back to the heat source by the wick structure. The working principle of the vapor chamber is similar to that of the heat pipe. However, the heat pipe conducts heat in one dimension and in a line. Nevertheless, the vapor chamber conduct heat through a two-dimensional surface area. The vapor chamber can also provide higher efficiency (10-20%) heat transfer than a heat pipe. Currently, use of the copper net as the wick structure is basically the major approach. The copper net is fixed in between two metal plates and vacuum the chamber. In this study, we will design the groove and micro-post structure as the wick structure and optimize the fluid recycling efficiency. The wick structure can be directly patterned on the lower plate when it is fabricated. By this method, we could lower down the manufacturing cost. In the study, the microstructure will be produced by using micro-fabrication. The capillary force will be studied. The optimized microstructure will also be studied. Following, one piece forming structure will be used to make the structure on metal plate, the vapor chamber will be sealed, and the heat conduction efficiency will be directly tested.均熱板微結構微流道散熱裝置毛細結構。Vapor chambermicrostructuremicro heat dissipationwick structure.