Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates

Wang, S.S.S.S.WangTseng, Y.H.Y.H.TsengTUNG-HAN CHUANG2020-05-122020-05-122006https://scholars.lib.ntu.edu.tw/handle/123456789/492014Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substratesjournal article10.1007/s11664-006-0199-52-s2.0-32644438301https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644438301&doi=10.1007%2fs11664-006-0199-5&partnerID=40&md5=1c97dd880bf8c109a2ee58d57d09c5c8