2016-10-012024-05-18https://scholars.lib.ntu.edu.tw/handle/123456789/706838摘要：發展半導體前段製程檢測基礎設備與關鍵技術，已成為我國高科技產業亟需全力發展的重點，此即為本深耕計畫之技術發展方向與人才培育目標。本計畫擬研發之晶圓檢測精密量測平台與關鍵光學量測探頭模組，目標將運用於晶圓生產前段製程之精密量測或瑕疵檢測工程，量測平台可整合具抗振性光學量測探頭模組，發展晶圓表面之平整度檢測設備與技術，同時量測平台未來可整合國內漢微科或台灣電鏡所研發之電子束掃描探頭模組，進行晶圓N10新顯影製程計畫之缺 陷 檢 測關鍵技術與設備。 申請團隊將整合台大機械系之精密量測、精密定位控制與精密機構設計三個實驗室，緊密成為一個研發團隊，持續深耕與整合實驗室長期發展的技術，關鍵於整合Micro-CMM精密量測、奈米級精密定位控制以及精密平台與機構設計等方面的經驗與技術能量，在此計畫中致力於晶圓檢測精密量測平台與關鍵光學量測探頭之研發，本計畫四年期所發展量測平台之精度規格水準，將以測量範圍達 300×300×50 mm3、掃描量測速度達40 m/min、以及空間體積定位誤差控制在50 nm (+_3s)以內為技術發展目標。同時，此深根技術計畫將以台大工學院現有的製造研發中心與精密製造中心為發展基礎，除了致力發展本深耕研發方向之基礎技術外，也將擴大發展與業界之聯盟合作關係，以強化國內半導體檢測相關設備廠商之實質參與度以及建立聯盟關係。在人才培育方面將以本校光機電學程(教育部立案)為發展基礎，實質深化發展成為高階檢測設備之人才培育機制。<br> Abstract: The development of semiconductor inspection equipment and measuring technologies,especially for wafer fabrication, has become one of the most key technologies to strengthen Taiwan global competitiveness. The project aims to develop the precision measuring platform and key optical measuring probes & techniques and educate the engineering talents for fulfilling this important need. The developed measuring platform can be integrated with the surface measuring optical probes, being developed by the project, to form a measuring system for wafer flatness verification during or after wafer CMP. More importantly, in the new N10 development era, it can be also further integrated with an E-beam inspection module from Hermes or Taiwan Electron microscope instrument Corp. to form an automated defect inspection system for wafer pattern inspection after lithography. The research team will be mainly formed by three technological research labs in the department of Mechanical Engineering of National Taiwan University. The team will focus to develop and synthesize the key technologies developed in last twenty to thirty years, such as the Abbe-free micro coordinate measuring machine (CMM) and calibration technologies, large range nano-scale positioning technologies and precision mechanical design and fabrication into the developed theme. By the development, it is set to achieve a measuring platform with a measuring range up to 300×300×50 mm3 while its speed is kept up to 40 m/min and its spatial volumetric error controlled within 50 nm(+_3s). The innovative optical probes can be also developed to perform simultaneous measurement on nano-scale linear displacement and micro-arcsecond scale angular deviation (such as Pitch or Yaw). Meanwhile, to educate the talents required in industries, the project will be further strengthening the existing MOE-founded optomechatronic program in NTU and inviting experts from industries to the training.精密量測自動化光學檢測晶圓檢測光學量測探頭奈米定位。precision metrologyautomated optical inspection (AOI)wafer inspectionoptical measuring probesnano-scale positioning.晶圓檢測精密量測平台與關鍵光學量測探頭之研發(2/4)