莊東漢2006-07-252018-06-282006-07-252018-06-282000http://ntur.lib.ntu.edu.tw//handle/246246/12377固液擴散接合是利用一種低熔點金屬薄膜做為中間層在較低溫溶解並與電子構裝的金屬化層快速反應形成高熔點的介金屬化合物而達到低溫接合高溫使用的特殊功能。本子計畫主要針對其界面反應之機理及動力學進行深入的探討。本報導綜合有關Cu/Sn , Cu/In , Ni/Sn , Ni/In , Au/Sn , Au/In , Au-InSn , Ni/Bi 系統之研究成果。Solid-liquid interdiffusion bonding (SLID) is an advanced technique for the microjoints of electronic packaging. This technique used a low melting metallic thin-film interlayer, which melts at low temperatures and rapidly reacts with the metallized layer of electron package to form high melting intermetallic compounds, thus achieving the special features of bonding at low temperatures and use at high temperatures. The efforts of this subprogram focus on the interfacial reaction mechanisms and kinetics during the SLID process. The report involves the results in Cu/Sn , Cu/In , Ni/Sn , Ni/In , Au/Sn , Au/In , Au-InSn and Ni/Bi systems.application/pdf1369781 bytesapplication/pdfzh-TW國立臺灣大學材料科學與工程學研究所固液擴散接合銲錫反應薄膜反應Solid-liquid interdiffusion bondingsoldering reactionsthin-film reactionsreporthttp://ntur.lib.ntu.edu.tw/bitstream/246246/12377/1/892216E002029.pdf