Using Grey relational analysis to determine wet chemical etching parameters in through-silicon-via etching application

Tang, C.-W.C.-W.TangYoung, H.-T.H.-T.YoungHONG-TSU YOUNG2018-09-102018-09-102013http://www.scopus.com/inward/record.url?eid=2-s2.0-84875222971&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/378631Using Grey relational analysis to determine wet chemical etching parameters in through-silicon-via etching applicationjournal article10.1016/j.mssp.2012.09.003