Time-varying wetting behavior on copper wafer treated by wet-etching

Tu, S.-H.S.-H.TuWu, C.-C.C.-C.WuWu, H.-C.H.-C.WuCheng, S.-L.S.-L.ChengSheng, Y.-J.Y.-J.ShengTsao, H.-K.H.-K.TsaoYU-JANE SHENG2018-09-102018-09-102015http://www.scopus.com/inward/record.url?eid=2-s2.0-84926391950&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/391426Time-varying wetting behavior on copper wafer treated by wet-etchingjournal article10.1016/j.apsusc.2015.01.048