Au-Sn bonding material for the assembly of power integrated circuit module

Zhu Z.X.Li C.C.Liao L.L.Liu C.K.C. ROBERT KAO2019-11-272019-11-27201609258388https://www.scopus.com/inward/record.uri?eid=2-s2.0-84959296179&doi=10.1016%2fj.jallcom.2016.02.065&partnerID=40&md5=af868a0df4fb52a676774e522c452aa6https://scholars.lib.ntu.edu.tw/handle/123456789/432598Au-Sn bonding material for the assembly of power integrated circuit modulejournal article10.1016/j.jallcom.2016.02.0652-s2.0-84959296179