Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates

CHIEN-CHENG CHANGLin Y.W.Lai Y.S.C. ROBERT KAO2019-11-272019-11-27200903615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-70349861935&doi=10.1007%2fs11664-009-0866-4&partnerID=40&md5=a620ca38bda31208177d8c22c2035c48https://scholars.lib.ntu.edu.tw/handle/123456789/432676Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substratesjournal article10.1007/s11664-009-0866-42-s2.0-70349861935