Die cooling system design and process parameters study for hot stamping

Tyng-Bin HuangChia-Wei HouFUH-KUO CHENTsu-Hsin ChiangPing-Kun Lee,Ping-Kun Lee2021-10-182021-10-182012https://scholars.lib.ntu.edu.tw/handle/123456789/585095https://www.scopus.com/inward/record.uri?eid=2-s2.0-84898452415&partnerID=40&md5=cd5b85241df28281373d820398814820Die cooling system design and process parameters study for hot stampingjournal article2-s2.0-84898452415