Kao C.R.Chuang H.Y.Chen W.M.Yang T.L.Kuo M.S.Chen Y.J.Yu J.J.C. ROBERT KAO2019-11-272019-11-272012978146731966905695503https://www.scopus.com/inward/record.uri?eid=2-s2.0-84866865839&doi=10.1109%2fECTC.2012.6248912&partnerID=40&md5=66441cc947896f5e0edad920394ad203https://scholars.lib.ntu.edu.tw/handle/123456789/432635[SDGs]SDG11Soldering reactions under space confinement for 3D IC applicationsconference paper10.1109/ECTC.2012.62489122-s2.0-84866865839