Wu K.-HChou H.-TLin D.-B.HSI-TSENG CHOU2022-04-252022-04-252021https://www.scopus.com/inward/record.uri?eid=2-s2.0-85123289966&doi=10.23919%2fISAP47258.2021.9614363&partnerID=40&md5=36cef53fbc1128941866ce8b6182715ahttps://scholars.lib.ntu.edu.tw/handle/123456789/607128Sub-Terahertz frequencies are potential bands for 6G applications. Due to the small wavelengths, antenna-in-package (AiP) technologies will be used to realize the antenna system for compactness and low dielectric losses. This paper presents an AiP design at 110 GHz for potential 6G applications. The target is to examine the behaviors of currently available dielectric substrates and fabrication mechanical process. Numerical full-wave simulations are performed to design an array of 8 8× elements to exhibit the basic characteristics. ? 2021 Taiwan Microwave Association.6G mobile communicationsAntenna-in-packagephased array of antennasSub-Terahertz frequency5G mobile communication systemsAntenna phased arraysDielectric lossesMicrowave antennasSubstrates6g mobile communicationAntenna in packagesMobile communicationsPackage technologiesPhased array of antennaPhased-arraysSub-terahertzSub-terahertz frequencyTerahertz frequenciesWavelength antennasTerahertz waves[SDGs]SDG7conference paper10.23919/ISAP47258.2021.96143632-s2.0-85123289966