Shih, P. S.P. S.ShihHuang, C. H.C. H.HuangC. ROBERT KAO2023-06-092023-06-092023-10-0509258388https://scholars.lib.ntu.edu.tw/handle/123456789/632032High-density Cu nanotwins in columnar grains were successfully fabricated within an electroless-deposited Cu film using a formaldehyde-based electroless plating solution. Such a structure was achieved by using a standard electroless plating process without high-speed stirring. Additives within the plating bath induced the crystallization of the nanotwinned structure in the reduced Cu atoms. In addition, the deposited Cu nanotwins comprised as high as 87% of the (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process indicate that this method is promising for future applications in the electronics industry.Electroless plating | Nanotwinned Cu | Preferred orientationother10.1016/j.jallcom.2023.1705312-s2.0-85159210564https://api.elsevier.com/content/abstract/scopus_id/85159210564