Fu-Ling ChangYu-Hsin LinHan-Tang HungC. ROBERT KAO2024-07-012024-07-012024-0603645916https://www.scopus.com/record/display.uri?eid=2-s2.0-85192081116&origin=resultslisthttps://scholars.lib.ntu.edu.tw/handle/123456789/719544Owing to the low melting temperature and excellent mechanical properties, In is considered a potential low-temperature solder. However, the interfacial reaction between In and Cu substrates is still unclear, specifically regarding the stability of CuIn2. Although CuIn2 was often observed at the Cu–In thin film after long-term aging below 100 °C, it is considered as a metastable phase and has not been added into the Cu–In phase diagram yet. In this study, the stability of CuIn2 and the peritectoid reaction Cu11In9 + In → CuIn2 were established using the Cu/In diffusion couple, Cu–In alloy phase equilibria, and decomposition investigation of CuIn2. The peritectoid temperature was determined to be in the range of 110–105 °C. Finally, thermodynamic assessment was conducted based on the experimental data and the revised Cu–In phase diagram.falseCu–In intermetallic compoundsCu–In phase diagramDiffusion coupleLow-temperature solderPhase equilibriaThermodynamic assessmentjournal article10.1016/j.calphad.2024.1027002-s2.0-85192081116