Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Liu, Yu-ChihYu-ChihLiuLin, Wei-HongWei-HongLinLin, Hsiu-JenHsiu-JenLinChuang, Tung-HanTung-HanChuang2009-01-062018-06-282009-01-062018-06-282006http://ntur.lib.ntu.edu.tw//handle/246246/95950application/pdf528312 bytesapplication/pdfen-USIntermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu padsjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95950/1/92.pdf