Lin Y.H.Tsai C.M.Hu Y.C.Lin Y.L.C. ROBERT KAO2019-11-272019-11-27200503615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-13244294160&doi=10.1007%2fs11664-005-0176-4&partnerID=40&md5=e7204e8112cd38138208239bdc6d64dbhttps://scholars.lib.ntu.edu.tw/handle/123456789/432718Electromigration-induced failure in flip-chip solder jointsjournal article10.1007/s11664-005-0176-42-s2.0-13244294160