2016-11-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/693403摘要：銀厚膜作為混成電路導線材料已有數十年歷史，然而銀厚膜在潮濕環境會發生銀離子遷移現象，導致電子元件短路失效；對於封裝打線接合材料，市場上現有金線、鋁線及銅線均存在一些問題，由國內樂金公司與台大共同研發成功Ag-Au-Pd合金銲線已經得到IC及LED封裝大廠的驗證及普遍採用，其價格為金線的15-20%，由於其介金屬成長適中，部分可靠度試驗項目甚至優於傳統金線封裝產品，已經成為打線接合銲線材料的主流之一，進一步推出二元Ag-Pd合金線，具有高導電性及低成本優點，適用於高頻IC元件封裝，亦已成為市場主流產品，此外，樂金公司也擁有銀合金線表面被覆貴金屬鍍層的專利。然而，客戶在使用銀合金線時，經常會基於過去銀厚膜的經驗，而有銀離子遷移的顧慮，在少數案例中，也確實發現由於客戶封膠不良導致濕氣侵入打線接合銲點，引發疑似離子遷移現象，本計畫目的在於經由最佳化的合金組成及晶粒結構調控，提升銀合金銲線的抗離子遷移性，以解除封裝業者在使用銀合金線的疑慮，其中在銀合金銲線的合金組成設計包括添加不同含量Pd的二元銀合金銲線及Ag-Pd再添加Pt、Au、Ni等元素的多元銀合金銲線，晶粒結構調控則包括晶粒尺寸、退火孿晶及長條晶之效應，本計畫也將評估銀合金線表面被覆貴金屬鍍層對銀離子遷移的抑制效應；另方面，就學術研究角度，本計畫綜合各項實驗結果，可以建立銀合金銲線的離子遷移反應機制，並且深入了解其抑制原理。<br> Abstract: Silver thick film has been used for interconnecting hybrid microelectronics for several decades. However, Ag-ion electrolytic migration was found to cause electronic devices to short circuit and fail in conditions of high humidity. For the wire bonding materials in electronic packaging, traditional Au、Al and Cu wires have encountered many problems. The Ag-Au-Pd alloy wire developed by Wire Technology Co. LTD and National Taiwan University has been verified and widely applied by IC and LED packaging companies. It has the advantages of low cost (about 20% of Au wire), high reliability (even higher than that of Au wire in certain reliability test items), and adequate intermetallic growth. Recently, a binary Ag-Pd hase been introduced for high frequency devices, requiring low electrical resistivity and low cost. However, the customers are enevitable to consider the concern of Ag-ion migration leading from the experience of Ag thick film. In fact, a suspicious ion migration phenomenon has been actually observed in certain Ag-alloy wire bonding products due to defect of encapsulation. This aim of this project will be focused on the alloy design and control of grain structure for Ag-allo bonding wires in order to release the concern of electronic industry on ion migration. The study of alloy design involves the addition of various Pd contents and the other metallic elements such as Pt、Au and Ni. The control of grain structure involves the effects of grain size, annealing twins and slender grains on ion migration. Furthermore, the coating of noble metallic thin films such as Au、Pd and Pt on Ag-alloy bonding wires will also be considered. From the view-point of fundamental research, the mechanism of ion igration in Ag-alloy bonding wires and the principle to inhibit this failure can be proposed summarizing the experimental results in this project.銀合金銲線離子遷移水滴試驗合金組成設計晶粒結構調控表面被覆貴金屬Ag-alloy bonding wiresion migrationwater drop testalloy designgrain structure controlsurface coation with noble metals