Parameter analysis of chemical mechanical polishing: An investigation based on the pattern planarization model

DAR-ZEN CHENLee, B.-S.B.-S.Lee2020-01-132020-01-131999https://scholars.lib.ntu.edu.tw/handle/123456789/447187Parameter analysis of chemical mechanical polishing: An investigation based on the pattern planarization modeljournal article10.1149/1.13924892-s2.0-0033359774https://www.scopus.com/inward/record.uri?eid=2-s2.0-0033359774&doi=10.1149%2f1.1392489&partnerID=40&md5=6f482955bcc7dc8971fe5aa5f4c912ca